MediaTek Dimensity 1200 6nm SoC with Dual SIM 5G, up to 168Hz displays and Dimensity 1100 announced

MediaTek just announced Dimensity 1200 and Dimensity 1100, the company’s latest top-end SoCs with built-in 5G. These are the company’s first mobile chips to use TSMC’s 6nm process technology. The Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz for extreme performance, three Arm Cortex-A78 super cores clocked up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz.

This promises up to 22% faster CPU performance and 25% more power-effeciency compared to the previous generation. It has nine-core Mali-G77 GPU offering 13% increase in performance compared to the previous generation and six-core MediaTek APU 3.0.

The Dimensity 1100 is designed with an octa-core CPU which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz, along with a same nine-core Arm Mali-G77 GPU and six-core MediaTek APU 3.0.

These support 5G standalone and non-standalone architectures with True Dual SIM 5G (5G SA + 5G SA). The Dimensity 1200 supports 200MP photos, has five-core HDR-ISP, 4K HDR video capture while the Dimensity 1100 has 108MP camera support. Both chipsets support AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.

The Dimensity 1200 supports ultra-fast 168Hz refresh rates and the Dimensity 1100 supports 144Hz refresh rates. Both feature MediaTek’s HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity, plus multi-touch boost touchscreen responsiveness. The new chipsets also support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.

These have Bluetooth 5.2, support ultra-low latency true wireless stereo audio and LC3 encoding for higher quality, lower latency streaming audio. The Dimensity 1200 has received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios.

The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to roll out at the end of Q1 and beginning of Q2 this year. Xiaomi, Vivo, OPPO and realme have partnered with MediaTek to use the chips in their phones. ARM, China Mobile, Tetras.AI, ArcSoft and Tencent Games are other partners. Among these realme has confirmed that it will be one of the first to release Dimensity 1200 powered flaghip.

MediaTek Dimensity 1200 and Dimensity 1100 specifications